Development of the Piezoelectric based Vibration Polishing System for Low Stress CMP

碩士 === 國立中正大學 === 機械工程所 === 94 === As the demand of the integrated circuit process requires more capacity and higher resolution, interconnect resistance-capacitance (RC) time delay becomes an important factors. A material with the low dielectric constant (low-K) and copper wire can be utilized to ac...

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Bibliographic Details
Main Authors: Hsuan-Yu Lee, 李軒宇
Other Authors: Meng-Shiun Tsai
Format: Others
Language:en_US
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/g627a5

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