Development of the Piezoelectric based Vibration Polishing System for Low Stress CMP
碩士 === 國立中正大學 === 機械工程所 === 94 === As the demand of the integrated circuit process requires more capacity and higher resolution, interconnect resistance-capacitance (RC) time delay becomes an important factors. A material with the low dielectric constant (low-K) and copper wire can be utilized to ac...
Main Authors: | Hsuan-Yu Lee, 李軒宇 |
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Other Authors: | Meng-Shiun Tsai |
Format: | Others |
Language: | en_US |
Published: |
2005
|
Online Access: | http://ndltd.ncl.edu.tw/handle/g627a5 |
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