Finite Element Simulation and Analysis on Tape Automated Bonding Packaging of Inner Lead Bonding Process
碩士 === 中華大學 === 機械與航太工程研究所 === 94 === The geometric layout of TAB and the bonding condition have a great impact on the Inner Lead Bonding (ILB) process of the Tape Automated Bonding (TAB) technology. The subject of this thesis is to investigate how the stress variation of lead is influenced by lead...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10978962540446236657 |