| Summary: | 碩士 === 建國科技大學 === 機電光系統研究所 === 94 === Besides excellent insulation, temperature and aging resistance, the best flame resistance among the polymers （no toxic substance release, even they are burning to black）leads Phenolic resin applications to structural adhesive, composites and paint. However. During the curing process, some water are produced as by-product. They will remain inside and/or on surface as the source of voids. The existence of void inside Phenolic substrate reduces the mechanical performance and cannot be used for high strength structures.
In this study, to reduce the void content of RTM phenolics is the main objective. At first. Compared by the experiment ( The interfacial materials selected) known plastic membrane can reduce voids content ,and specimen have smooth surface. In the VARTM process, Plant plastic membrane into the mould cavity. The filled of reinforcement fibers impregnation with phenolic resin. And after testing via a series of mechanical strength. Verify plastic membrane can raise mechanical strength, reducing voids and easy to de-mold of properties, etc. In the future, be going to apply phenolic resin composite developed for aircraft interiors and structures, and rise using to be worth.
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