Packaging Attribute Deployment for New Product Introduction in Notebook Computer Industry
碩士 === 中原大學 === 工業工程研究所 === 94 === The purpose of this article is focused on the packaging issues in notebook NPI(New Product Introduction) stage that enterprises encounter when practicing global logistics. It acquires the weight of product design by QFD(Quality Function Deployment) in two phases. T...
Main Authors: | Chien-Ping Liao, 廖建評 |
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Other Authors: | Hsin Rau |
Format: | Others |
Language: | zh-TW |
Published: |
2006
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Online Access: | http://ndltd.ncl.edu.tw/handle/60801292383771280467 |
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