Research of Accurately Control of the Pick and Place Novel Mechanisms for Semiconductor

• Main Authors: Hung-Cheng Yau, 姚泓成
• Other Authors: Chin-Wen Chuang
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/51276455341904681071

碩士 === 義守大學 === 電機工程學系碩士班 === 94 === In the most of IC packing technology can find through wafer sawing for next process request. Pick and Place control approached request stabilization by motion control and mechanical design and avoided to damage wafer chip at adsorption process. There are general two kinds of mechanical motion during Pick and Place control: (I) Fixed point swing arm. (II) Screw driving. But they had disadvantages: (1) Mechanism complex. (2) Many control actuators (3) request heavy load (4) Spell much time to study at Fixed point swing arm and chip Pick/Place position repeated low. In this paper research, I prefer new method which different above two methods to approach the same chip Pick and Place motion. Applied to planet gear and solar gear shift circular path and transferred to square path. According to mechanical operate mathematics model and proof motion path by VB. From motion path adjusted mechanical relation size and homologized motor rpm range to decrease mechanical design error and velocity issue cause to request mechanical motion and precision fail. At last, Using to achievement drive servo motor and planet gear achievement drive and proof mathematics model.