Research of Accurately Control of the Pick and Place Novel Mechanisms for Semiconductor
碩士 === 義守大學 === 電機工程學系碩士班 === 94 === In the most of IC packing technology can find through wafer sawing for next process request. Pick and Place control approached request stabilization by motion control and mechanical design and avoided to damage wafer chip at adsorption process. There are general...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51276455341904681071 |