| Summary: | 碩士 === 國立高雄應用科技大學 === 模具工程系碩士班 === 94 === At present, a lot of manufactures of the electronic products possess the characteristic of miniaturization and denseness, which cause the heat that is produced by the unit area of the electronic element rising continuously. Therefore, the cooling technology of the electronic element becomes very important subject now. The electronic element can have better heat dissipation effect. Setting about from the design of different geometry heat sinks at first. It can reach the best thermal efficiency, so as to reduce working temperature of the electronic packages.
In this study, the experiment is used to exam the all section temperature distribution of the heat sinks by infrared thermalvision. It is discussed the heat dissipation efficiency of different geometry heat sinks. It can be realized that among these different geometry heat sinks, which one has the best heat dissipation effect.The test models have in accordance with different geometry forms, such as plate-fin heat sink, pin-fin heat sink, staggered diamond pin fin heat sink, staggered elliptical pin fin heat sink, which confer and compare the heat dissipation efficiency of different geometry heat sinks by controlling the heat source and the rotational speeds of the fan. Under the same experiment condition, the way of above-blow fan makes the heat dissipation efficiency. The best heat dissipation efficiency is pin-fin heat sink. The second one is staggered elliptical pin fin heat sink. The third one is staggered diamond pin fin heat sink. The final one is plate-fin heat sink. The way of side-blow fan makes the heat dissipation efficiency. The best heat dissipation efficiency is pin fin heat sink. The second one is staggered diamond pin fin heat sink. The final one is staggered elliptical pin fin heat sink. All heat sinks is designed by the same heat transfer area. So all heat sinks make the different heat dissipation efficiency that is influenced by the fin numbers and the fin volumes.
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