Simulation and Analysis of Heat Dissipation Sink on LED Backlight

• Main Authors: Kai-Chung Tseng, 曾愷中
• Other Authors: 莊書豪
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/25064068099559418542

碩士 === 國立中興大學 === 機械工程學系所 === 94 === This dissertation is for analysing sink parameters in High Power LED backlight, targeting at application for LCD. Because the stability and lifetime of a semiconductor element can be affected by long time usage or high temperature, the best design of sink was found by using several approaches. Firstly, this experiement measured temperature for sink on LED in a constant temperature environment. Then, CFD was used for simulation and analysis, considering four parameters, thickness of base, high of sink, thickness of sink and distance between sinks. After that, results from experiment and simulation were compared for verification. Finally, Taguchi Method was used for getting the best sink structure. The experiment proved that with the following parameters, 5 mm base thickness, 2 mm sink thickness, 6 mm distance between sinks and 16 mm sink high, And crisscross design for single row sink. The best heat dissipation result can be provided. It does not only improve the efficient by 24.86 %, but also reduces The temperature difference. consequently, it avoid color washout problem which is caused by the temperature difference between different rows of sinks. In conclusion, according to the result calculated by using heat resistant formular, the temperature for each junction is 73.1 ℃, and the maximum acceptable temperature for each LED junction is 120 ℃. Hence, the sink model designed in this thesis can meet safety requirement.