Fabrication and Characterization of GaN LED Bonding Pads Using a Electroless Plating Process
碩士 === 國立中興大學 === 精密工程學系所 === 94 === An electroless plating technique is used to deposite the Au electrode pads on GaN light-emitting diodes (LEDs) by applying photolithography and lift-off processes. It was found that the metallic seed layer on the pre-determined electrode region played an importan...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72522959614321630418 |