Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers

碩士 === 國立交通大學 === 電子工程系所 === 94 === A low noise amplifier is applied for ultra-wideband. This research is fabricated in 0.18-μm CMOS process. The three-order band-pass Chebyshev filter can reach the broadband input impedance matching. Owing to the low power consideration, plus the additional gate ca...

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Main Author: 邱子倫
Other Authors: 荊鳳德
Format: Others
Language:en_US
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/16412336720670592371
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spelling ndltd-TW-094NCTU54280832016-05-27T04:18:35Z http://ndltd.ncl.edu.tw/handle/16412336720670592371 Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers 1.8伏金氧半低雜訊放大器之設計應用於超寬頻UWB3.1-10.6GHZ無線接收端 邱子倫 碩士 國立交通大學 電子工程系所 94 A low noise amplifier is applied for ultra-wideband. This research is fabricated in 0.18-μm CMOS process. The three-order band-pass Chebyshev filter can reach the broadband input impedance matching. Owing to the low power consideration, plus the additional gate capacitor . The cacoded structure gain stage provides the gain of the amplifier. The capacitor reduces the gain degradation caused by at high frequency. The inductive shunt peaking maintain the gain flatness. Output buffer is used for output broadband matching. The low noise amplifier introduces the shunt peaking to achieve the flat gain purpose. The total power dissipation of the chip is about 18 mW at power supply 1.8 volt. The chip size included pad is 0.992 mm2. The measurement result of this study expect that the forward gain S21 is 6 to 9.7dB at 3.1-10.6GHz, the reverse isolation S12 is under -20dB, the average S11 is under -7 dB, the average S22 is under -10dB, the noise figure minimum is 6dB, and IIP3 is 6dBm. 荊鳳德 2006 學位論文 ; thesis 54 en_US
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language en_US
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description 碩士 === 國立交通大學 === 電子工程系所 === 94 === A low noise amplifier is applied for ultra-wideband. This research is fabricated in 0.18-μm CMOS process. The three-order band-pass Chebyshev filter can reach the broadband input impedance matching. Owing to the low power consideration, plus the additional gate capacitor . The cacoded structure gain stage provides the gain of the amplifier. The capacitor reduces the gain degradation caused by at high frequency. The inductive shunt peaking maintain the gain flatness. Output buffer is used for output broadband matching. The low noise amplifier introduces the shunt peaking to achieve the flat gain purpose. The total power dissipation of the chip is about 18 mW at power supply 1.8 volt. The chip size included pad is 0.992 mm2. The measurement result of this study expect that the forward gain S21 is 6 to 9.7dB at 3.1-10.6GHz, the reverse isolation S12 is under -20dB, the average S11 is under -7 dB, the average S22 is under -10dB, the noise figure minimum is 6dB, and IIP3 is 6dBm.
author2 荊鳳德
author_facet 荊鳳德
邱子倫
author 邱子倫
spellingShingle 邱子倫
Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers
author_sort 邱子倫
title Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers
title_short Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers
title_full Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers
title_fullStr Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers
title_full_unstemmed Design of a 1.8 -V CMOS LNA applied for Ultra-Wideband 3.1 to 10.6GHZ Wireless Receivers
title_sort design of a 1.8 -v cmos lna applied for ultra-wideband 3.1 to 10.6ghz wireless receivers
publishDate 2006
url http://ndltd.ncl.edu.tw/handle/16412336720670592371
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