Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function
碩士 === 國立交通大學 === 機械工程系所 === 94 === Polymer micromolding technique are becoming increasingly important in recent years. Compared with other molding technique, hot embossing is favorable for molding microstructures and optical devices because of its low flow rate and low material flow character. Howe...
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ndltd-TW-094NCTU54890502016-05-27T04:18:35Z http://ndltd.ncl.edu.tw/handle/34387035159502454271 Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function 應用具有局部快速加熱能力的模仁的微米成形技術的開發 蔡沛原 碩士 國立交通大學 機械工程系所 94 Polymer micromolding technique are becoming increasingly important in recent years. Compared with other molding technique, hot embossing is favorable for molding microstructures and optical devices because of its low flow rate and low material flow character. However, due to the differences of thermal expansion coefficient between polymer and mold insert, shrinking of polymer in the cooling stage may lead the mold cavities to press the microstructure from both sides. This force will cause the demolding destruction of microstructures and limit the application of molding larger surface areas and higher aspect ratio microstructures on hot embossing technique. Therefore, this study improve the mold insert with rapid heating-function which our laboratory develop and use it to surmount the limit on micro-hot-embossing. We try to use P type silicon wafer as mold insert and implant phosphorous ion into the surface of silicon wafer to make mold insert have heating function. With the heating function, we can decrease the thermal stress of polymer in molding process. Experiment results demonstrate that the microstructure will produce these defects with creak, slant, damage in the mold insert at demolding when the microstructure by hot embossing has filled with up to 3 times of aspect ratio. Applying appropriate heating power to the surface of mold insert can decrease the thermal stress effectively in the cooling stage to solve the problem of demolding and can improve non-uniform shrinkage of polymer. 陳仁浩 2006 學位論文 ; thesis 76 zh-TW |
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碩士 === 國立交通大學 === 機械工程系所 === 94 === Polymer micromolding technique are becoming increasingly important in recent years. Compared with other molding technique, hot embossing is favorable for molding microstructures and optical devices because of its low flow rate and low material flow character. However, due to the differences of thermal expansion coefficient between polymer and mold insert, shrinking of polymer in the cooling stage may lead the mold cavities to press the microstructure from both sides. This force will cause the demolding destruction of microstructures and limit the application of molding larger surface areas and higher aspect ratio microstructures on hot embossing technique. Therefore, this study improve the mold insert with rapid heating-function which our laboratory develop and use it to surmount the limit on micro-hot-embossing. We try to use P type silicon wafer as mold insert and implant phosphorous ion into the surface of silicon wafer to make mold insert have heating function. With the heating function, we can decrease the thermal stress of polymer in molding process.
Experiment results demonstrate that the microstructure will produce these defects with creak, slant, damage in the mold insert at demolding when the microstructure by hot embossing has filled with up to 3 times of aspect ratio. Applying appropriate heating power to the surface of mold insert can decrease the thermal stress effectively in the cooling stage to solve the problem of demolding and can improve non-uniform shrinkage of polymer.
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陳仁浩 |
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陳仁浩 蔡沛原 |
author |
蔡沛原 |
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蔡沛原 Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function |
author_sort |
蔡沛原 |
title |
Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function |
title_short |
Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function |
title_full |
Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function |
title_fullStr |
Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function |
title_full_unstemmed |
Development of Polymer Micro-Hot-Embossing Process Using a Novel Mold Insert with Rapid Heating-Function |
title_sort |
development of polymer micro-hot-embossing process using a novel mold insert with rapid heating-function |
publishDate |
2006 |
url |
http://ndltd.ncl.edu.tw/handle/34387035159502454271 |
work_keys_str_mv |
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