Micro Machining Using Micro-EDM Combined with Electro-codeposition

• Main Authors: Wei-Chieh Wu, 吳瑋榤
• Other Authors: Biing-Hwa Yan
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/76253981674426257186

碩士 === 國立中央大學 === 機械工程研究所 === 94 === Abstract This study presents a novel process of using micro-electro-discharge-machining (micro-EDM) combined with electro-codeposition to fabricate the micro-grinding-tool to machining a micro-hole on high nickel alloy. During the machining process, a micro-grinding-tool is fabricated by wire electro-discharge grinding (WEDG) and electro-codeposition directly by using micro-EDM for machining the micro-hole and by micro-grinding to finish the hole wall. The experimental result shows the suitable parameters obtained to fabricating micro-grinding-tool for electro-codeposition are considered to be the following: electric current of 10 mA, hole diameter of positive ring is 5 mm, SiC particle size of 4μm, SiC particle concentration of 10 g/L, rotational speed of 15 rpm and CTAB of 150 ppm. By this method, The micro-grinding-tool will provided with smoothness surface on coating layer, uniform particle distribution and suitable adhesion particle quantity. Finally, the tool feed adopts as 30 μm/min in micro-grinding process, the surface roughness reduces from 1.47 μm Rmax (0.2 μm Ra) to 0.462 μm Rmax (0.026 μm Ra) after micro-grinding.