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• Main Authors: Jiuan-Wei Tseng, 曾俊瑋
• Other Authors: Bin-Lung Ou
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/45239162674493139302

碩士 === 國立中央大學 === 機械工程研究所 === 94 === Abstract This thesis focus on the survey of soft and hard aluminum foil primarily. By changing concentration , etching temperature and etching waveform. We investigated the effects of etching morphology on the surface increment. This experiment first used potentiostat to observe the relationship between potential-time and potential-corrosive current under different etching parameters. Thus we could predict the reaction during etching process. According to the selected parameters of electrochemical etching, the aluminum foils have been etched, and the capacitance was measured under EIAJ specifications. For surface, oxide replicas and cross section morphology studies, the samples were examined in the SEM, SEM and OM respectively From the experiments, it was found that there was a proper sulfuric and hydrochloric acid concentration for increment etching. At this concentration we could get a fine microstucture for increasing capacitance. Phosphoric acid could grow a passive film, which protected aluminum from Cl- corrosion. Increased etching temperature could accelerate the diffusion of Cl-. There also had proper etching waveform and temperature for etching process.