Studying the Effects of Different Types and Different Particles Sizes On Porous Silica Low-K Thin Films
碩士 === 國立臺灣大學 === 化學工程學研究所 === 94 === Mesoporous silica has been widely studied for low-k materials, because of it’s low dielectric constant (about 2), good thermal stability, and friendly-preparation procedures. However, the porosity in the film makes the mechanical strength insufficient. The impro...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67918218444782079190 |