An application of six sigma methodology to improve the soldering coverage problem in a diode manufacturing process

• Main Authors: Wen-Hsin Wang, 王文信
• Other Authors: Chao Ou-Yang
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/e43857

碩士 === 國立臺灣科技大學 === 工業管理系 === 94 === Unlike the other Semiconductor business, Diode manufacturing technology of nowadays is much more mature, therefore the threshold of being a player in this industry is relatively lower. Though the market demand is stable, unfortunately the margin is severely eroded due to the price hiking of base material, polycrystalline silicon and other base metal, which are used for diode manufacturing. Hence, the manufacturing quality and cost are the name of the game for the diode makers to assure competitiveness and survival. Six Sigma is a systematic methodology for continuous quality improvement and for achieving operational excellence. This paper deals with the application of Six Sigma based methodology in improving SMD soldering coverage problem in a diode manufacturing company. By realizing the customer’s expectation and understanding the critical to quality (CTQ) variables of the soldering process for SMD production, this company starts evaluating the feasibility to using Six Sigma for problem solving. The DMAIC (Define, Measure, Analyze, Improve, and Control) approach has been followed here to solve an underlying problem of reducing process variation and the associated poor process yield in meeting customer’s satisfaction. This paper explores also how a foundry can use a systematic and disciplined approach to move towards the goal of Six Sigma quality level. The application of the Six Sigma methodology resulted in a reduction of the solder void percentage encountered in the SMD product and increased the process capability from 0.73 to 1.39.