| Summary: | 碩士 === 淡江大學 === 化學工程與材料工程學系碩士班 === 94 === Electrochemical properties of electrodeposited Cu/Co multilayers were investigated by potentiodynamic curve and electrochemical impedance spectroscope. X-ray diffraction (XRD) and scanning electron microscopy were used to study the sample structure and morphology. It was revealed that CuCl may cover the electrode surface at the higher Cu deposition potential, it makes the electrode surface rough. The higher the Co deposition potential, the smaller the grain size. Using Vegard’s law to calculate the composition of the direct current plated Cu-Co solid solution was 89~96%. According to the result of XRD, the structure of Cu-Co alloy is mainly face-centered cubic phase. The result of XRD of the multilayers did not have obvious satellite peak. At higher Cu deposition potential, there are many grains on the surface of multilayers. At the higher Co deposition potential, there are holes on the multilayers surface resulted from the evolution of H2. Finally, the cross-section of the multilayers did not show obvious layered structure, because the preparation of the sample is difficult.
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