Investigation of the Electrochemical Properties of Co/Cu Multilayers
碩士 === 淡江大學 === 化學工程與材料工程學系碩士班 === 94 === Electrochemical properties of electrodeposited Cu/Co multilayers were investigated by potentiodynamic curve and electrochemical impedance spectroscope. X-ray diffraction (XRD) and scanning electron microscopy were used to study the sample structure and morph...
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ndltd-TW-094TKU050630172016-05-30T04:21:20Z http://ndltd.ncl.edu.tw/handle/30261753310713388920 Investigation of the Electrochemical Properties of Co/Cu Multilayers 銅鈷多層膜電化學特性研究 Zong-Rong Wu 吳宗榮 碩士 淡江大學 化學工程與材料工程學系碩士班 94 Electrochemical properties of electrodeposited Cu/Co multilayers were investigated by potentiodynamic curve and electrochemical impedance spectroscope. X-ray diffraction (XRD) and scanning electron microscopy were used to study the sample structure and morphology. It was revealed that CuCl may cover the electrode surface at the higher Cu deposition potential, it makes the electrode surface rough. The higher the Co deposition potential, the smaller the grain size. Using Vegard’s law to calculate the composition of the direct current plated Cu-Co solid solution was 89~96%. According to the result of XRD, the structure of Cu-Co alloy is mainly face-centered cubic phase. The result of XRD of the multilayers did not have obvious satellite peak. At higher Cu deposition potential, there are many grains on the surface of multilayers. At the higher Co deposition potential, there are holes on the multilayers surface resulted from the evolution of H2. Finally, the cross-section of the multilayers did not show obvious layered structure, because the preparation of the sample is difficult. Yu-Chi Chang 張裕祺 2004 學位論文 ; thesis 58 zh-TW |
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碩士 === 淡江大學 === 化學工程與材料工程學系碩士班 === 94 === Electrochemical properties of electrodeposited Cu/Co multilayers were investigated by potentiodynamic curve and electrochemical impedance spectroscope. X-ray diffraction (XRD) and scanning electron microscopy were used to study the sample structure and morphology. It was revealed that CuCl may cover the electrode surface at the higher Cu deposition potential, it makes the electrode surface rough. The higher the Co deposition potential, the smaller the grain size. Using Vegard’s law to calculate the composition of the direct current plated Cu-Co solid solution was 89~96%. According to the result of XRD, the structure of Cu-Co alloy is mainly face-centered cubic phase. The result of XRD of the multilayers did not have obvious satellite peak. At higher Cu deposition potential, there are many grains on the surface of multilayers. At the higher Co deposition potential, there are holes on the multilayers surface resulted from the evolution of H2. Finally, the cross-section of the multilayers did not show obvious layered structure, because the preparation of the sample is difficult.
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author2 |
Yu-Chi Chang |
author_facet |
Yu-Chi Chang Zong-Rong Wu 吳宗榮 |
author |
Zong-Rong Wu 吳宗榮 |
spellingShingle |
Zong-Rong Wu 吳宗榮 Investigation of the Electrochemical Properties of Co/Cu Multilayers |
author_sort |
Zong-Rong Wu |
title |
Investigation of the Electrochemical Properties of Co/Cu Multilayers |
title_short |
Investigation of the Electrochemical Properties of Co/Cu Multilayers |
title_full |
Investigation of the Electrochemical Properties of Co/Cu Multilayers |
title_fullStr |
Investigation of the Electrochemical Properties of Co/Cu Multilayers |
title_full_unstemmed |
Investigation of the Electrochemical Properties of Co/Cu Multilayers |
title_sort |
investigation of the electrochemical properties of co/cu multilayers |
publishDate |
2004 |
url |
http://ndltd.ncl.edu.tw/handle/30261753310713388920 |
work_keys_str_mv |
AT zongrongwu investigationoftheelectrochemicalpropertiesofcocumultilayers AT wúzōngróng investigationoftheelectrochemicalpropertiesofcocumultilayers AT zongrongwu tónggǔduōcéngmódiànhuàxuétèxìngyánjiū AT wúzōngróng tónggǔduōcéngmódiànhuàxuétèxìngyánjiū |
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1718284278175891456 |