Topological Optimization in Compliant Mechanisms for Micro-electro Mechanical System

博士 === 淡江大學 === 機械與機電工程學系博士班 === 94 === A systematic analysis and study concerning the techniques of the topological optimization applying to compliant mechanisms synthesis are presented in this thesis. During the structural topology optimization, a singular hinge-like appears and then requires to b...

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Bibliographic Details
Main Authors: Chih-Feng Lin, 林志豐
Other Authors: Chien-Jong Shih
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/69503536261393748442
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Summary:博士 === 淡江大學 === 機械與機電工程學系博士班 === 94 === A systematic analysis and study concerning the techniques of the topological optimization applying to compliant mechanisms synthesis are presented in this thesis. During the structural topology optimization, a singular hinge-like appears and then requires to be eliminated or be further modified. A pseudo-rigid-body model had been studied at first, then the typical flexural hinge analysis had been applied and transformed to a multiobjective optimization design model for improving the characteristics of flexural joints. The presented optimization process can obtain superior results than the conventional multi-stage optimization, particularly, the ratio of output motion to input motion on a compliant mechanism has been improved. This study adopts the outcome of the topological optimization as the initial model, then combines the proposed multiobjective optimization strategy for eliminating the unrealistic hinge-like phenomenon. This post-design process not only can deal with flexures but also can dramatically increase the overall performance of the compliant structure. It can be concluded that the geometrical center of a typical flexure exactly is the center of a hinge-like location that was observed and experimented from topology optimization. Eventually, this work continuously proposed a simplifying design model to redesign the flexures for promoting the overall performance. The proposed design method and process had been applied to several micro electro-mechanical structural design included a thermal-actuated amplifying compliant mechanism.