Study on the arrangement of Thermal Cooling System for Desktop PCs

• Main Authors: Chun-Ho Shen, 沈俊合
• Other Authors: Ji-Jen Lee
• Format: Others
• Language: en_US
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/47209013895614786551

碩士 === 大同大學 === 電機工程學系(所) === 94 === Thermal technology of the vertical type desktop computers is the unceasing desired development and research. Along with the computer interior thermal problems, unless seeking more innovative thermal projects, we should improve the mistakes of the original thermal design and also remove the waste heat effectively from the electronic circuit which power is gradually strengthening. Therefore, how to apply the numerical analysis software correctly and effectively and to understand the interior thermal status of the computer system and the behavior pattern further is needed. Thus, analyzing and improving the interior thermal mechanism of the computer system which enables to achieve the ideal operating environment temperature is the primary research goal for this paper. The research is focused on analyzing different types of computer case’s structure and the component’s allocation through be cooperated with Orthogonal Array of the experimental plan to make the simulation plan. By analyzing each factor of the thermal mechanism via the result of Orthogonal Array plan, it is try to arrange the optimization combination of the related condition limit and also forecast its result and tendency from the simulation. Besides, from the result of the simulation, it is found that transmission pattern of the heat energy and the flow field in the system. It may be summarized the following conclusions from the result of the simulation analysis: (1) A good design of Orthogonal Array could figure out the factors which actually affect the target. While deciding the influential factors, we should consider all the primary factors and cooperate with the correlation action of Orthogonal Array for avoiding unnecessary experiment time. (2) For reducing the impedance of the system, the efficiency of the fan and the collocation of the baffle will affect CPU performance the most. Especially, the influence of the baffle is worthy to investigate and the position of case hole and the position of the system’s fan are all studied. Sacrificing the operating temperature of the secondary elements will get more air flow and do good helpful for CPU thermal dissipation.