| Summary: | 碩士 === 大同大學 === 機械工程學系(所) === 93 === Following the functional enhancement and miniaturization of electronic product, the heat density of the product component increases rapidly. Therefore how to diffuse the highly concentrated heat energy to the heat sink for heat dissipation is the important key. This research utilizes the Dura aluminum alloy to produce the vapor chamber hoping that it can provide a research reference in the design of effective heat dissipation method in personal computer. In addition, the principle of tube is utilized that is applied in general traditional aluminum heat sink under the consideration of low cost and high safety so as to enhance its heat dissipation efficiency. In addition, based on experiment method, the best working fluid and filling volume and the height inside the vapor chamber can be found so as to cope with the heat dissipation requirement of super high temperature electronic component in the future.
Aiming at the different interior height and bottom thickness of the
vapor chamber (internal height 8mm, bottom thickness 2mm) and (internal height 5mm, bottom height 5mm), working fluid filling volume, effect on the heat sink function of different type of filling liquid and fixed wind volume, this essay conducts experiment research and comparison. From the experiment data, it shows that when the heat dissipation effect is the best when the filling volume is 54.34% and 52.17% respectively. Also, when the working fluid adopts methanol, the heat dissipation result is better than water. In addition, the heat dissipation result of the vapor chamber (with internal height of 5mm and bottom thickness of 5mm) is better than the vapor chamber (with internal height of 8mm and bottom thickness of 2mm).
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