| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 95 === Digital times are approaching. Customers have great interests in digital camera, MP3 and mobile phone, which are the powerful motive to create the flash memory card. The dimension control to it is strict and precise. Especially the plan ness must be controlled within 0.15mm, or empty-welding on the contact of connecter will occur, which will bring about some difficulties to bind the memory card connecter to the PCB of SMT process. This dissertation aims to probe into the warpage of flash memory card connecter, forecast the possible question through CAE analysis, and select the most proper type of gate, and optimize it through the differentiation caused by the molding condition regulation with Taguchi-methods.
The research result in this thesis shows that the gate forms have great influence on the defects such as warp & deformation of memory card connecter, comparing with the four gate forms imitated by the computer; even we get the conclusion that the gate form of three Δ dots has the minimum impacts on the warp & deformation. What’s more, we establish the form of “ mold flow analysis & Taguchi-methods ” to gain the key factors that influence the products’ warp & deformation, and with this form, we can save the assessment time and save the cost of repairing the mold during the period of mold developing. And then it became one of the most outstanding achievements in the warp & deformation of research on the memory card connecter, and it also provides a reference for the supplier to improve the quality.
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