Modeling and Predicting of Surface Roughness of Silicon Wafer Grinding
碩士 === 大葉大學 === 機械工程研究所碩士班 === 95 === Manufacturing of silicon wafer starts with growth of silicon ingots. Typical processes to turn a silicon ingot to silicon wafers include slicing, edge profiling, grinding, lapping, polishing, etching etc. Grinding lapping and polishing are used to flatten the ro...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79918682631059825391 |