An investigation of the effects of fixed abrasive chemical mechanical polishing to shallow trench isolation process
碩士 === 國立成功大學 === 工程科學系專班 === 95 === At present, chemical mechanical polishing (CMP) is the most effective technology to achieve global planarization in semiconductor manufacturing processes. In recent years, the feature size of the IC processes is down to the nanometer range. Because the interconne...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09326768543061965596 |