High Conductivity and Low-Curing-Temperature Silver Paste
博士 === 國立交通大學 === 材料科學與工程系所 === 95 === In this studied, first, six low curing pastes were prepared from silver flake and ��-terpineol and with different metallo-organic decomposition (MOD) compounds. The thermal decomposition behaviors of the pastes were performed. The microstructures and resistivit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44106501300164972981 |