Synthesis and Properties of Cyanate Ester Containing Siloxane and Imide Groups

• Main Authors: Shih-Wei Yang, 楊時韋
• Other Authors: Mu-Shih Lin
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/71874586854991098098

碩士 === 國立交通大學 === 應用化學系所 === 95 === 　　The research deals with synthesis of cyanate ester V containing siloxane and imide groups , which was then mixed with a commercial epoxy resin “Tetraglycidyl meta-Xylenediamine (GA-240)”, followed by curing in various equivalent ratios of GA-240/V. Functional group changes during curing reaction were investigated by FT-IR. The curing behavior was studied by dynamic DSC at different rising temperature rate. The curing activation energy of the epoxy resin that containing cyanate ester V was found much lower than the pure epoxy resin , presumably because of the catalysis of tertiary amine in the cyanate ester V. Thermal mechanical properties were measured by TMA and TGA. These cured materials indicate glass transition temperatures ranging from 199℃ to 207℃. On-set of decomposition temperature was found at around 286℃ for the pure GA-240 with improved thermal stability upon incorporation of cyanate ester V. The dielectric constants of the cured materials were in the range of 4.3 to 3.2.