Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application

博士 === 國立交通大學 === 應用化學系所 === 95 === In this study novel materials based on epoxy and cyanate ester containing siloxane and imide groups were investiged.Chapter I dealed with siloxane- and imide-containing tetrafunctional epoxy, which was designed mainly to improve mechanical performance , thermal st...

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Bibliographic Details
Main Authors: Wang Ming Wei, 王明偉
Other Authors: Mu-Shih Lin
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/97713747641454863837
Description
Summary:博士 === 國立交通大學 === 應用化學系所 === 95 === In this study novel materials based on epoxy and cyanate ester containing siloxane and imide groups were investiged.Chapter I dealed with siloxane- and imide-containing tetrafunctional epoxy, which was designed mainly to improve mechanical performance , thermal stability and dimensional stability. In chapter II, incorporating POSS moiety into epoxy resin resulted in reduction of dielectric constant with sacrifice of some other properties. BT resin, ie., blend of cyanate ester and bismaleimide (BMI), possesses good mechanical strength and is currently used in packaging material. However, lack of resin curing and dielectric constant are drawbacks of the commercial BT resin. Therefore, focus on the improvement of resin curing, dielectric constant and mechanical performance was the important goal in chapters III, IV and V, where siloxane , imide and allyl groups were incorporated into a cyanate ester. This cyanate ester was blended with equivalent amounts of modified BMI to form a novel BT resin. Materials are then prepared by co-curing this novel BT resin with different epoxies to improve the resin curing and material performances. For better understanding of optimal application, curing behavior was studied in chapter III. Properties of the co-cured materials were studied in chapters III, IV, and V. In chapter V, co-cured materials were also prepared by blending the novel BT resin with commercial epoxy to form part A resin, which then, further co-cured with different amounts of a novel epoxy containing siloxane and imide. This co-cured material possessed most of the properties required for microelectronic application. Study of curing kinetics is given in chapter VI. In kinetic studies of the three components system (cyanate ester/ BMI/epoxy), functional group changes basically were the combination of the two systems ( cyanate ester/epoxy and cyanate ester/BMI). There was no new chemical bonding found between the two net works( cyanate ester/epoxy and cyanate ester/BMI). Kinetic parameters found indicated very similar to one another among the three different systems. The rate constant of catalytic reaction (k2) was approximately 10 times higher than that of non-catalytic reaction (k1). Increased activation energies for both catalyzed (E2) and non-catalyzed (E1) reactions were observed, compared with those of the component material. This finding explained the lower gel fractions of co-cured materials.