Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application

博士 === 國立交通大學 === 應用化學系所 === 95 === In this study novel materials based on epoxy and cyanate ester containing siloxane and imide groups were investiged.Chapter I dealed with siloxane- and imide-containing tetrafunctional epoxy, which was designed mainly to improve mechanical performance , thermal st...

Full description

Bibliographic Details
Main Authors: Wang Ming Wei, 王明偉
Other Authors: Mu-Shih Lin
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/97713747641454863837
id ndltd-TW-095NCTU5500065
record_format oai_dc
spelling ndltd-TW-095NCTU55000652016-05-04T04:16:30Z http://ndltd.ncl.edu.tw/handle/97713747641454863837 Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application 電子用之新型環氧樹脂與新型BT樹脂共交聯材料之研究 Wang Ming Wei 王明偉 博士 國立交通大學 應用化學系所 95 In this study novel materials based on epoxy and cyanate ester containing siloxane and imide groups were investiged.Chapter I dealed with siloxane- and imide-containing tetrafunctional epoxy, which was designed mainly to improve mechanical performance , thermal stability and dimensional stability. In chapter II, incorporating POSS moiety into epoxy resin resulted in reduction of dielectric constant with sacrifice of some other properties. BT resin, ie., blend of cyanate ester and bismaleimide (BMI), possesses good mechanical strength and is currently used in packaging material. However, lack of resin curing and dielectric constant are drawbacks of the commercial BT resin. Therefore, focus on the improvement of resin curing, dielectric constant and mechanical performance was the important goal in chapters III, IV and V, where siloxane , imide and allyl groups were incorporated into a cyanate ester. This cyanate ester was blended with equivalent amounts of modified BMI to form a novel BT resin. Materials are then prepared by co-curing this novel BT resin with different epoxies to improve the resin curing and material performances. For better understanding of optimal application, curing behavior was studied in chapter III. Properties of the co-cured materials were studied in chapters III, IV, and V. In chapter V, co-cured materials were also prepared by blending the novel BT resin with commercial epoxy to form part A resin, which then, further co-cured with different amounts of a novel epoxy containing siloxane and imide. This co-cured material possessed most of the properties required for microelectronic application. Study of curing kinetics is given in chapter VI. In kinetic studies of the three components system (cyanate ester/ BMI/epoxy), functional group changes basically were the combination of the two systems ( cyanate ester/epoxy and cyanate ester/BMI). There was no new chemical bonding found between the two net works( cyanate ester/epoxy and cyanate ester/BMI). Kinetic parameters found indicated very similar to one another among the three different systems. The rate constant of catalytic reaction (k2) was approximately 10 times higher than that of non-catalytic reaction (k1). Increased activation energies for both catalyzed (E2) and non-catalyzed (E1) reactions were observed, compared with those of the component material. This finding explained the lower gel fractions of co-cured materials. Mu-Shih Lin 林木獅 2007 學位論文 ; thesis 161 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 博士 === 國立交通大學 === 應用化學系所 === 95 === In this study novel materials based on epoxy and cyanate ester containing siloxane and imide groups were investiged.Chapter I dealed with siloxane- and imide-containing tetrafunctional epoxy, which was designed mainly to improve mechanical performance , thermal stability and dimensional stability. In chapter II, incorporating POSS moiety into epoxy resin resulted in reduction of dielectric constant with sacrifice of some other properties. BT resin, ie., blend of cyanate ester and bismaleimide (BMI), possesses good mechanical strength and is currently used in packaging material. However, lack of resin curing and dielectric constant are drawbacks of the commercial BT resin. Therefore, focus on the improvement of resin curing, dielectric constant and mechanical performance was the important goal in chapters III, IV and V, where siloxane , imide and allyl groups were incorporated into a cyanate ester. This cyanate ester was blended with equivalent amounts of modified BMI to form a novel BT resin. Materials are then prepared by co-curing this novel BT resin with different epoxies to improve the resin curing and material performances. For better understanding of optimal application, curing behavior was studied in chapter III. Properties of the co-cured materials were studied in chapters III, IV, and V. In chapter V, co-cured materials were also prepared by blending the novel BT resin with commercial epoxy to form part A resin, which then, further co-cured with different amounts of a novel epoxy containing siloxane and imide. This co-cured material possessed most of the properties required for microelectronic application. Study of curing kinetics is given in chapter VI. In kinetic studies of the three components system (cyanate ester/ BMI/epoxy), functional group changes basically were the combination of the two systems ( cyanate ester/epoxy and cyanate ester/BMI). There was no new chemical bonding found between the two net works( cyanate ester/epoxy and cyanate ester/BMI). Kinetic parameters found indicated very similar to one another among the three different systems. The rate constant of catalytic reaction (k2) was approximately 10 times higher than that of non-catalytic reaction (k1). Increased activation energies for both catalyzed (E2) and non-catalyzed (E1) reactions were observed, compared with those of the component material. This finding explained the lower gel fractions of co-cured materials.
author2 Mu-Shih Lin
author_facet Mu-Shih Lin
Wang Ming Wei
王明偉
author Wang Ming Wei
王明偉
spellingShingle Wang Ming Wei
王明偉
Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application
author_sort Wang Ming Wei
title Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application
title_short Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application
title_full Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application
title_fullStr Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application
title_full_unstemmed Co-cured Materials Based on Novel Epoxies and Novel BT Resins for Electronic Application
title_sort co-cured materials based on novel epoxies and novel bt resins for electronic application
publishDate 2007
url http://ndltd.ncl.edu.tw/handle/97713747641454863837
work_keys_str_mv AT wangmingwei cocuredmaterialsbasedonnovelepoxiesandnovelbtresinsforelectronicapplication
AT wángmíngwěi cocuredmaterialsbasedonnovelepoxiesandnovelbtresinsforelectronicapplication
AT wangmingwei diànziyòngzhīxīnxínghuányǎngshùzhīyǔxīnxíngbtshùzhīgòngjiāoliáncáiliàozhīyánjiū
AT wángmíngwěi diànziyòngzhīxīnxínghuányǎngshùzhīyǔxīnxíngbtshùzhīgòngjiāoliáncáiliàozhīyánjiū
_version_ 1718255165415358464