High Power Light Emitting Diode Package Study
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 95 === By the increasing of Light output at light-emitting diodes(LED), the LED is beginning to show widespread application on the market. From the indicator light, traffic signal light, backlighting for LCD television and cellphone, car lighting and the ma...
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ndltd-TW-095NCTU56860252015-10-13T16:13:48Z http://ndltd.ncl.edu.tw/handle/41451175903243777660 High Power Light Emitting Diode Package Study 高功率發光二極體之封裝研究 Chia-Lin Wu 吳佳霖 碩士 國立交通大學 工學院碩士在職專班半導體材料與製程設備組 95 By the increasing of Light output at light-emitting diodes(LED), the LED is beginning to show widespread application on the market. From the indicator light, traffic signal light, backlighting for LCD television and cellphone, car lighting and the market of white light source, it makes a new vitality in the LED industry. With the variety of application area, the LED technology goes toward two direction. One of the application is the chip miniaturization, it is used in the cellphone, digital camera and the Laptop. The other one is the large format panel, it is used to the backlighting for LCD television, lamp of projector, car headlight, architectural and the outdoor lighting. No matter what the chip miniaturization or the large area display, how to improve the light efficiency of LED chip for increasing light intensity is the common topic. To enhance the bright intensity of LED, one is to increase the light efficiency of LED and the other one is to increase the input power. By increasing the input power to achieve high brightness, the adequate heat-sinking is required to be improved. to be improved. In this thesis, we focused on the large area LED in the high input power application. We developed a new package experiment to improve the heat-sinking problem. Based on the cost and functionality, we choose the Silicon for the package substrate. We designed two layout on the Silicon chip in order to fix the same phase P/N and different phase P/N of 40mil chip on the substrate. After we accomplished the substrate, we used array method to fix the two chips and applied the current from 20mA to 2A to measure the Luminous flux、Vf、and Dominate wavelength. Edward Yi Chang 張翼 2007 學位論文 ; thesis 91 zh-TW |
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碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 95 === By the increasing of Light output at light-emitting diodes(LED), the LED is beginning to show widespread application on the market. From the indicator light, traffic signal light, backlighting for LCD television and cellphone, car lighting and the market of white light source, it makes a new vitality in the LED industry.
With the variety of application area, the LED technology goes toward two direction. One of the application is the chip miniaturization, it is used in the cellphone, digital camera and the Laptop. The other one is the large format panel, it is used to the backlighting for LCD television, lamp of projector, car headlight, architectural and the outdoor lighting. No matter what the chip miniaturization or the large area display, how to improve the light efficiency of LED chip for increasing light intensity is the common topic.
To enhance the bright intensity of LED, one is to increase the light efficiency of LED and the other one is to increase the input power. By increasing the input power to achieve high brightness, the adequate heat-sinking is required to be improved. to be improved.
In this thesis, we focused on the large area LED in the high input power application. We developed a new package experiment to improve the heat-sinking problem. Based on the cost and functionality, we choose the Silicon for the package substrate. We designed two layout on the Silicon chip in order to fix the same phase P/N and different phase P/N of 40mil chip on the substrate. After we accomplished the substrate, we used array method to fix the two chips and applied the current from 20mA to 2A to measure the Luminous flux、Vf、and Dominate wavelength.
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Edward Yi Chang |
author_facet |
Edward Yi Chang Chia-Lin Wu 吳佳霖 |
author |
Chia-Lin Wu 吳佳霖 |
spellingShingle |
Chia-Lin Wu 吳佳霖 High Power Light Emitting Diode Package Study |
author_sort |
Chia-Lin Wu |
title |
High Power Light Emitting Diode Package Study |
title_short |
High Power Light Emitting Diode Package Study |
title_full |
High Power Light Emitting Diode Package Study |
title_fullStr |
High Power Light Emitting Diode Package Study |
title_full_unstemmed |
High Power Light Emitting Diode Package Study |
title_sort |
high power light emitting diode package study |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/41451175903243777660 |
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