Polyimides for Adhesiveless Flexible Copper Clad Laminate

• Main Authors: Chun-Kang Ku, 古俊綱
• Other Authors: Yu-Der Lee
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/76080025214889516926

博士 === 國立清華大學 === 化學工程學系 === 95 === The main purpose of this research is to develop new PIs, which are applied for the manufacture of polyimide-based adhesiveless flexible copper clad laminate via sputter/electro-deposition and hot-pressing procession, respectively. In the first part, a series of PIs containing pyridine as well as triazole were synthesized. The corresponding polyimide films exhibit a good balance in thermal, mechanical and dielectric properties, as does the PMDA-ODA film. XPS indicates that the LOF of the laminates occurs either at the interface or in the polyimide. This complex substantially promoted the adhesion between sputter-deposited copper and PIs. In the second part, a series of pyridine-containing PISs with different amounts of PDMS with various segmental lengths were synthesized. The effects of the content and the segmental length of PDMS on the Tg, Dk and Rs of the copolymer are investigated. XPS shows that the LOF is either cohesive or adhesive. In the final part, a series of amorphous PIS segmented copolymers with various PDMS segmental lengths and contents were synthesized. Extraction was utilized to obtain highly pure PISs for a study of phase separation. The morphology of the PIS changes as a function of its segmental length and content. DSC reveals that the phase separation is induced and dominated by the aggregation of the PDMS segments.