Polyimides for Adhesiveless Flexible Copper Clad Laminate
博士 === 國立清華大學 === 化學工程學系 === 95 === The main purpose of this research is to develop new PIs, which are applied for the manufacture of polyimide-based adhesiveless flexible copper clad laminate via sputter/electro-deposition and hot-pressing procession, respectively. In the first part, a series of PI...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76080025214889516926 |