Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material
碩士 === 國立清華大學 === 工程與系統科學系 === 95 === At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance be...
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ndltd-TW-095NTHU55930252015-10-13T14:08:38Z http://ndltd.ncl.edu.tw/handle/63072920902327608273 Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material 熱介面材料(T.I.M.)之K值測定與靈敏度分析 Yu-Hsiu Fu 傅裕修 碩士 國立清華大學 工程與系統科學系 95 At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance between heat source and the heat sink. In order to obtain the optimal selection, we need to measure the thermo properties of the T.I.M. very accuracy. The purpose of this paper is to build up a very high sensitivity T.I.M. measuring system which was based on one-dimension heat transfer theory and the precise processing technology. This article includes four parts, the first one is to discuss the effect of the different thickness of the spacer to the sensitivity of the instrument, the second part and the third part was discussing the repeatability and the reproducibility respectively. The fourth part was used dummy heater developed by ECS laboratory to evaluate the thermo resistance value of the grease and double check was that consistence evaluate from T.I.M. instrument. The experiment results showed that the ABS spacer developed by ECS laboratory a very good sensitivity performance. The relative error of the conductivity coefficient from the repeatability experiment was within 5%, while the relative error for the contact resistance was within 10%. The relative error of the reproducibility made by different operator was control within 2%. Wei-Keng Lin Ying-Kai Fu 林唯耕 傅應凱 2007 學位論文 ; thesis 108 zh-TW |
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碩士 === 國立清華大學 === 工程與系統科學系 === 95 === At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance between heat source and the heat sink. In order to obtain the optimal selection, we need to measure the thermo properties of the T.I.M. very accuracy. The purpose of this paper is to build up a very high sensitivity T.I.M. measuring system which was based on one-dimension heat transfer theory and the precise processing technology.
This article includes four parts, the first one is to discuss the effect of the different thickness of the spacer to the sensitivity of the instrument, the second part and the third part was discussing the repeatability and the reproducibility respectively. The fourth part was used dummy heater developed by ECS laboratory to evaluate the thermo resistance value of the grease and double check was that consistence evaluate from T.I.M. instrument. The experiment results showed that the ABS spacer developed by ECS laboratory a very good sensitivity performance. The relative error of the conductivity coefficient from the repeatability experiment was within 5%, while the relative error for the contact resistance was within 10%. The relative error of the reproducibility made by different operator was control within 2%.
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author2 |
Wei-Keng Lin |
author_facet |
Wei-Keng Lin Yu-Hsiu Fu 傅裕修 |
author |
Yu-Hsiu Fu 傅裕修 |
spellingShingle |
Yu-Hsiu Fu 傅裕修 Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material |
author_sort |
Yu-Hsiu Fu |
title |
Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material |
title_short |
Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material |
title_full |
Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material |
title_fullStr |
Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material |
title_full_unstemmed |
Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material |
title_sort |
thermal conductivity and sensitivity analysis of thermal interface material |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/63072920902327608273 |
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