The interfacial reaction and reliability between Sn-Zn Series lead-free solders with ENIG and OSP Substrates.
碩士 === 國立聯合大學 === 材料科學工程學系碩士班 === 95 === Two kinds of lead-free solders, Sn8Zn3Bi and Sn9ZnAl, were used to mount passive components onto OSP and ENIG finished printed circuit boards via a re-flow soldering process. The components mounted boards were aged at 150�aC for various times. After soldering...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/92302680452208953599 |