Investigation on Durability for Electronic Connectors

碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 95 === Contact forces between a terminal of an electronic connector and the corresponding counterparts play an important role on signal transmission. The mated terminal with insufficient contact force might severely raise electrical resistance and induce intermittenc...

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Bibliographic Details
Main Authors: Chi-Che Chang, 張其哲
Other Authors: Kuo-Chi Liao
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/01109312866072379579
Description
Summary:碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 95 === Contact forces between a terminal of an electronic connector and the corresponding counterparts play an important role on signal transmission. The mated terminal with insufficient contact force might severely raise electrical resistance and induce intermittence or disconnection of current eventually. For input/output connectors, however, the contact force of the terminal usually decays dramatically after several thousand mating/unmating cycles. Critical plane approaches are adopted to estimate the service life indicating the number of cycles as the contact force of the terminal degrades beneath the certain value here. Damage parameters based on various criteria are evaluated for the terminal under cyclic loading conditions. Relationships among the damage parameter, the contact force reduction ratio, and the number of cycles are then constructed by linking numerical results to experimental measurements. Proposed models could be further applied to durability investigations for the similar terminal design. Terminals of a central processor unit (CPU) socket connector dominate the signal transmissions between the CPU and a motherboard. The contact force of these terminals could decrease gradually due to the stress relaxation effect under the high temperature conditions. In the present study, a finite element analysis is conducted to construct relationships between the contact force and the duration period based on the specifications of field life acceleration test and thermal cyclic test of the Electronic Industry Association.