球面形陶瓷/Kevlar複合材料抗彈性能分析

碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 96 === The ballistic resistance performance experiencing normal and oblique impact is discussed widely on most reports. However, the ballistic resistance performance for sphere or curved surface is still rare. The objective of this study is to analyze the behavior...

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Bibliographic Details
Main Authors: Wei-Hsiang Chen, 陳煒翔
Other Authors: Yu-Liang Chen
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/94158363385603543418
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Summary:碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 96 === The ballistic resistance performance experiencing normal and oblique impact is discussed widely on most reports. However, the ballistic resistance performance for sphere or curved surface is still rare. The objective of this study is to analyze the behavior of sphere-shaped ceramic/Kevlar composite plate under impact. A hollow sphere-shaped ceramic / Kevlar composite plate was designed in this study. After producing the specimen, ballistic test was implemented to find out the ballistic limit. ANSYS/LS-DYNA3D software were then used to analyze the ballistic behavior by varying the parameters such as position of incidence, impact angle, thickness of specimen, etc.. The results showed that the sphere-shaped ceramic / Kevlar composite plate has better ballistic resistance capability than ceramic / Kevlar composite laminated board and the difference becomes significant when impact angle increases. At 40 degree, the bullet impacting sphere-shaped ceramic / Kevlar composite plate jumps aside. When incident angle is greater than 20 degree, sphere-shaped ceramic (5 mm) / Kevlar (5 mm) composite plate has similar ballistic limit velocity with ceramic (6.5 mm) / Kevlar (5 mm) laminated board but reduce weigh by 14%. In this study, we designed the sphere-shaped ceramic / Kevlar composite plate and established a simulation model to analyze the ballistic resistnace beharvior. It provides useful information for those who are interested in the related field of design and application.