Simulation and Verification on Simulation and Verification on the cyclicMold Temperature Variation using Pulsed-Cooling

• Main Authors: Yun-Chen Hsieh, 謝昀臻
• Other Authors: 陳夏宗
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/00928047032567386449

碩士 === 中原大學 === 機械工程研究所 === 96 === ABSTRACT Now, the 3C products is more and more popular, amd MEMS (Micro-Electro-Mechanical System) technology is rise and develope, injection molding knowledge has been used on micro size part and optic products which has micro feature. High temperature used on many detailed products , it’s the better way to get high quality. Mold temperature variation has some properties that are high mold temperature in filling phase and low mold temperature in cooling phase, and mold temperature variation can reduce cycle time. When we understand the property of mold temperature variation, it will help us to know how to control the mold temperature and product process. In this study, I set the temperature sensor in the mold, and record the temperature variation of Pulse-cooling to research the rise temperature of single cycle and the highest temperature of filling. Then simulated and analyzed by ANSYS® and Moldex 3D® software. From the experiment data, the effect of Pulse-cooling is decided by cooling efficiency of mold. In conventions cooling, the rise temperature of single cycle about from 2℃ to 2.47℃, and Pulse-cooling from 2.14℃ to 2.57℃. It’s show that the rise temperature of single cycle of Pulse-cooling is higher than conventions cooling, and the highest temperature of filling of Pulse-cooling is higher than conventions cooling sas well. Then we use ANSYS® and Moldex 3D® software to simulate and verify with experiment data. In ANSYS® simulate result, the simulate data is higher then experiment data, because there are gaps between the mold and temperature sensor. In ANSYS® and Moldex 3D® simulate of mold surface temperature, the result of simulation is very similarity with experiment data, and prove the simulation and verification of software is feasible.