A Study on Optimum Parameters of Wire Bonding for Alloy Wire in IC Assembly
碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 96 === none
Main Authors: | Jung-Chi Chen, 陳榮棋 |
---|---|
Other Authors: | none |
Format: | Others |
Language: | zh-TW |
Published: |
2008
|
Online Access: | http://ndltd.ncl.edu.tw/handle/67748255271241755361 |
Similar Items
-
A study on Optimum Parameters of Wire Bonding with Material and Alloy wires
by: Chao-Lin Chang, et al.
Published: (2014) -
The optimum parameter in the wire bonding process of the LED Assembly
by: Chris Tzeng, et al. -
Optimization of Parameter Design of Cu Wire Bonding Process in IC Assembly Industry
by: Yeh, Cheng-Jung, et al.
Published: (2011) -
Optimization of Silver Alloy Wire Bonding Parameters for IC Process
by: Yang,Yen-Lu, et al.
Published: (2019) -
Study of the Optimum Parameters of Finger Print Sensor IC in Wire Bonding for BGA Device
by: Yao,Shih-Che, et al.
Published: (2017)