Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking

碩士 === 逢甲大學 === 資訊電機工程碩士在職專班 === 96 === This research is to apply Nd:YAG laser (Neodymium Yttrium Aluminium Garnet laser) marking machine to perform wafer marking. Nowadays, most researches into laser process focus on some particular materials, such as metals, wood, or stainless steel. Few researche...

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Main Authors: Yen-Wei Chen, 陳彥為
Other Authors: Chin-Yen Chang
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/81141831606259758727
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spelling ndltd-TW-096FCU053920382015-11-27T04:04:42Z http://ndltd.ncl.edu.tw/handle/81141831606259758727 Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking 摻釹釔鋁石榴石雷射於整枚晶圓刻字參數最適化之探討 Yen-Wei Chen 陳彥為 碩士 逢甲大學 資訊電機工程碩士在職專班 96 This research is to apply Nd:YAG laser (Neodymium Yttrium Aluminium Garnet laser) marking machine to perform wafer marking. Nowadays, most researches into laser process focus on some particular materials, such as metals, wood, or stainless steel. Few researchers give attention to silicon wafer marking, nor does anyone provide the most appropriate method to select the parameters of Nd:YAG laser wafer marking; moreover, the quality of marking is not regarded with much importance. Therefore, whether the parameters are optimised is a key factor to experiments. As a result, this research applies TM (Taguchi Method) to get optimised parameters and uses these parameters to enhance the quality of laser marking, hoping to provide laboratories and industries using Nd:YAG laser wafer marking machines with standard models, such as parameter design and parameter verification, to reduce time and cost spent on testing. The four sets of parameters of Nd:YAG laser marking machine (laser power, laser pulse frequency, laser scanning speed, and power current) are critical to marking depth width ratio, marking density overlapping rate, and marking line diameter width, which are the decisive factors to marking quality. In this research, TM is applied to figure out the best combination of parameters, and the combination immediately undergoes experimental verification. The verification result is 0.762 for marking depth width ratio, 76.4% for marking density overlapping rate, and 40.43μm for marking line diameter width. In the forth chapter of this thesis, which is about the experiment on parameter design, laser wafer marking is performed in accordance with initial value. The result of the experiment is 0.726 for marking depth width ratio, 57.14% for marking density overlapping rate, and 43.25μm for marking line diameter. Comparing the result in chapter four with the result of the experimental verification, the three optimised parameters can make a 0.036-improvement to the marking depth width ratio, a 19.26%-improvement to the marking density overlapping rate, and a 2.82μm-improvement to the marking line diameter. Chin-Yen Chang 張勁燕 2008 學位論文 ; thesis 143 zh-TW
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description 碩士 === 逢甲大學 === 資訊電機工程碩士在職專班 === 96 === This research is to apply Nd:YAG laser (Neodymium Yttrium Aluminium Garnet laser) marking machine to perform wafer marking. Nowadays, most researches into laser process focus on some particular materials, such as metals, wood, or stainless steel. Few researchers give attention to silicon wafer marking, nor does anyone provide the most appropriate method to select the parameters of Nd:YAG laser wafer marking; moreover, the quality of marking is not regarded with much importance. Therefore, whether the parameters are optimised is a key factor to experiments. As a result, this research applies TM (Taguchi Method) to get optimised parameters and uses these parameters to enhance the quality of laser marking, hoping to provide laboratories and industries using Nd:YAG laser wafer marking machines with standard models, such as parameter design and parameter verification, to reduce time and cost spent on testing. The four sets of parameters of Nd:YAG laser marking machine (laser power, laser pulse frequency, laser scanning speed, and power current) are critical to marking depth width ratio, marking density overlapping rate, and marking line diameter width, which are the decisive factors to marking quality. In this research, TM is applied to figure out the best combination of parameters, and the combination immediately undergoes experimental verification. The verification result is 0.762 for marking depth width ratio, 76.4% for marking density overlapping rate, and 40.43μm for marking line diameter width. In the forth chapter of this thesis, which is about the experiment on parameter design, laser wafer marking is performed in accordance with initial value. The result of the experiment is 0.726 for marking depth width ratio, 57.14% for marking density overlapping rate, and 43.25μm for marking line diameter. Comparing the result in chapter four with the result of the experimental verification, the three optimised parameters can make a 0.036-improvement to the marking depth width ratio, a 19.26%-improvement to the marking density overlapping rate, and a 2.82μm-improvement to the marking line diameter.
author2 Chin-Yen Chang
author_facet Chin-Yen Chang
Yen-Wei Chen
陳彥為
author Yen-Wei Chen
陳彥為
spellingShingle Yen-Wei Chen
陳彥為
Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking
author_sort Yen-Wei Chen
title Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking
title_short Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking
title_full Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking
title_fullStr Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking
title_full_unstemmed Investigation on the Optimized Model Parameters by UsingNd:YAG Laser Wafer Marking
title_sort investigation on the optimized model parameters by usingnd:yag laser wafer marking
publishDate 2008
url http://ndltd.ncl.edu.tw/handle/81141831606259758727
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