| Summary: | 碩士 === 崑山科技大學 === 機械工程研究所 === 96 === With great advancement of science and technology, with the development of chip manufacturing processes, since the delivery of first single core Intel® Pentium® 90 nm process, an operational four core 32 nm processor has been announced in San Francisco in 2007. In the near future, micro-processors with more than four cores are on the way to the market.
It is obvious that with the increase of computational power, relative more heat is inevitable produced. Therefore, current CPU heat dissipation methods would be unable to deal with the higher heat-energy problem, as high as 350 watts. To cope with the situation, a new generation liquid cooling system is developed, based on and combining existing CPU cooling technologies.
In the paper, an Active-Liquid-Heat-Sink Technology is introduced for CPU cooling purposes. With this technology, the active liquid driving mechanism is integrated into the liquid heat sink, and the whole system can be assembled into a regular computer mother board.
The advantages of the system are not only its small size, light weight, convenient installation, but more importantly its very high cooling efficiency. Through the “LW-9091CPU Tester” that complies with U.S.A. ASTM-5470D standard, the experimental result verifies that this system has excellent thermal efficiency. Comparing with commercial air cool, heat pipe and internal liquid cooling systems, a better heat dissipation function of this system is testified.
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