| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程系碩士班 === 96 === The study was focus on the important preparation procedures of printed circuit board (PCB) such as, pre-treatment, lamination, exposure in UV light and developing, and applied the quality experiment to deal the operating parameters for the optimal operation.
The experiment was divided into two parts mainly. The first part was focus on molding procedure. The preheat temperature and molding temperature were discussed to reveal the concerns of flow characteristic of membrane on the board. Furthermore, experimental design method was also applied to deal the relationship between lamination speed and lamination temperature.
The second part we also applied the experimental design method to deal the five most important factors of the circuit quality, including processing speeds in the past, lamination pressure, lamination speed, exposure energy, and developing speed. The experimental results indicated that keeping the lamination speed is the key factor for the ability of covering dry film, and showed apparent influence comparing with the first lay board.
Furthermore, some optimal experimental results were found, which can be utilized to produce different circuits on board. According to this conclusion, it is believed that the improvement directions we found in the PCB field should be benefit, and can offer the industry as a valuable reference for the further development.
Key word: printed circuit board, circuit quality.
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