| Summary: | 碩士 === 國立高雄應用科技大學 === 模具工程系碩士班 === 96 === The research carry light on this research's back module design by flank the four LEDs sends out the ray, through light guide plate, the plank goes into the light the side microstructure of design, the microstructure will make the ray broken the total reflection of situation under, make ray with the certain angle becomes to face the light source after entering the microstructure, then face through the reflection and pay light face up microstructure of design, can the ray from flank to observation of direction, by microstructure of the characteristic makes ray even and provide the enough bright degree, satisfying display the light source needed.
The research's designing three-dimensional microstructure main intentions is making on the backlight module and can reduce a slice of prism cost, not only can reduce the spare parts cost for future, can also significantly reduce the thickness and weight of carrying on the backlight module to meet the need of the user.
In the meantime this research exploitation close die hot embossing manufacturing process, purpose is for canning get the better replication, and control hot embossing manufacturing process parameter, aim at single face the microstructure to make Taguchi methods quality design, find out the good best combination parameter of single replication, find in the process temperature more the high pressure power is more big, the replication that gains also opposite exaltation, after make use of again the whole factor method, and calculate to acquire replication and optical function to goodly lead the light plank every a tiny structure of the Sigma and the replica rate, inquire into copy rate, average luminance and all and together degree, three it the correlation of, measurement whole uniformity and average luminance, get a replication and optical function goodly light guide plate, can significant increase originally backlight uniformity and average luminance.
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