Viscoelastic Constitutive Model for Molding Compound and Its Application to Electronic Packaging Process Warpage Simulation

• Main Authors: Je-Li Gung, 龔哲立
• Other Authors: Tz-Cheng Chiu
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/99791986600432037276

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === Warpage is one of the most critical issues for area-array IC package. Excessive warpage may lead to misregistration of electrical interconnection. Package warpage typically occurs after the post-mold curing process as a result of mold compound curing shrinkage and the coefficient of thermal expansion (CTE) mismatch among package various constituents such as silicon die, molding compound and multilayer substrate. In order to accurately predicting the warpage and stress in IC packages, it is critical to develop a cure-time-temperature dependent model for describing the constitutive behavior of molding compound. In this thesis, the experimental approach for characterizing cure kinetics, cure-dependent coefficient of thermal expansion and cure-dependent viscoelastic constitutive behavior of molding compound are presented. By using the nonlinear material properties of the molding compound, finite element analysis are conducted to model the warpage evolution during post-mold curing process. Shadow Moir�� experiments are conducted to measure package warpage and compared to the simulation results.