Viscoelastic Constitutive Model for Molding Compound and Its Application to Electronic Packaging Process Warpage Simulation
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === Warpage is one of the most critical issues for area-array IC package. Excessive warpage may lead to misregistration of electrical interconnection. Package warpage typically occurs after the post-mold curing process as a result of mold compound curing shrinkage...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99791986600432037276 |