Study on Wafer-Level Packaging and Electrochemical Characterization of Planar Silver-Chloride Micro Reference Electrode
碩士 === 國立中山大學 === 電機工程學系研究所 === 96 === This thesis devotes to develop a wafer-level packaging technique of the planar AgCl-based micro reference electrode and to investigate its various electrochemical characteristics (including the potential stability and offset voltage, AC impedance, cyclic-voltam...
Main Authors: | Chi-Chih Chu, 朱吉植 |
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Other Authors: | I-Yu Huang |
Format: | Others |
Language: | zh-TW |
Published: |
2008
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Online Access: | http://ndltd.ncl.edu.tw/handle/ru9h7t |
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