Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry
碩士 === 國立中山大學 === 高階經營碩士班 === 96 === 英文摘要 Today,IC products have become a essential in the human life. Take the daily life of Taiwan’s people for example, people use the IC products in every minutes: mobile phone, credit card, health insurance card, etc. The competition between IC products also has...
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ndltd-TW-096NSYS54570912018-06-25T06:05:28Z http://ndltd.ncl.edu.tw/handle/4vpem2 Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry 跨部門知識整合之研究—以新產品驗證專案為例 Hsin-Chi Chen 陳信吉 碩士 國立中山大學 高階經營碩士班 96 英文摘要 Today,IC products have become a essential in the human life. Take the daily life of Taiwan’s people for example, people use the IC products in every minutes: mobile phone, credit card, health insurance card, etc. The competition between IC products also has been a vital war for the company to protect its market position. Time to market for the IC product has also become more and more important for the company to maintain or even survive. More powerful performance of the IC product rely on more professional marketing position forecast, innovated design and time to market manufacturing. To realize a IC product come from the manufacturing through the IC design house, foundry and the package. There should be with different expertise between the companies or inside the company. How to make sure with correct manufacturing through these expertise to meet the time-to-marketing challenge is very important, especially, right people in right position. What’s the role-play for the people during the manufacturing between and within the company/groups will be the focus in this thesis. Take the example for a semiconductor manufacturing company, there are divided with different functions of department. Each department has its own knowledge-based function to maintain or develop the related knowledge for a IC manufacturing. People should do the knowledge transfer inside the department and, moreover, the related functions with other departments. How do improve the efficiency through the effective communication and knowledge sharing will be discussed. The main results of this thesis are as the below 1. There are with built-up boundary between different groups/department organization due to its different job functions and expertise. It will be resulted as the communication barrier or knowledge transfer problem between these groups/organization even their goal is the same. 2. 5 categories can be identified for these barriers on the knowledge transfer and communication between different expertises. 3. Defined SOP(standard operation procedure) to communicate through documents and intensive discussion meeting can be improved to effective for the knowledge transfer between different groups/department organization, especially for the fresh engineers. 4. The psychological factor of human between different groups/organization is found to be another issue to block the knowledge transfer. How to eliminate the factor can be next study focus. Stephen D. Tsai Ching-fang Lee 蔡敦浩 李慶芳 2008 學位論文 ; thesis 63 zh-TW |
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碩士 === 國立中山大學 === 高階經營碩士班 === 96 === 英文摘要
Today,IC products have become a essential in the human life. Take the daily life of Taiwan’s people for example, people use the IC products in every minutes: mobile phone, credit card, health insurance card, etc. The competition between IC products also has been a vital war for the company to protect its market position. Time to market for the IC product has also become more and more important for the company to maintain or even survive. More powerful performance of the IC product rely on more professional marketing position forecast, innovated design and time to market manufacturing.
To realize a IC product come from the manufacturing through the IC design house, foundry and the package. There should be with different expertise between the companies or inside the company. How to make sure with correct manufacturing through these expertise to meet the time-to-marketing challenge is very important, especially, right people in right position. What’s the role-play for the people during the manufacturing between and within the company/groups will be the focus in this thesis. Take the example for a semiconductor manufacturing company, there are divided with different functions of department. Each department has its own knowledge-based function to maintain or develop the related knowledge for a IC manufacturing. People should do the knowledge transfer inside the department and, moreover, the related functions with other departments. How do improve the efficiency through the effective communication and knowledge sharing will be discussed.
The main results of this thesis are as the below
1. There are with built-up boundary between different groups/department organization due to its different job functions and expertise. It will be resulted as the communication barrier or knowledge transfer problem between these groups/organization even their goal is the same.
2. 5 categories can be identified for these barriers on the knowledge transfer and communication between different expertises.
3. Defined SOP(standard operation procedure) to communicate through documents and intensive discussion meeting can be improved to effective for the knowledge transfer between different groups/department organization, especially for the fresh engineers.
4. The psychological factor of human between different groups/organization is found to be another issue to block the knowledge transfer. How to eliminate the factor can be next study focus.
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author2 |
Stephen D. Tsai |
author_facet |
Stephen D. Tsai Hsin-Chi Chen 陳信吉 |
author |
Hsin-Chi Chen 陳信吉 |
spellingShingle |
Hsin-Chi Chen 陳信吉 Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry |
author_sort |
Hsin-Chi Chen |
title |
Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry |
title_short |
Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry |
title_full |
Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry |
title_fullStr |
Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry |
title_full_unstemmed |
Exploring Knowledge Spanning among Organizational boundary – A Case Study of New Product Project in Semiconductor Industry |
title_sort |
exploring knowledge spanning among organizational boundary – a case study of new product project in semiconductor industry |
publishDate |
2008 |
url |
http://ndltd.ncl.edu.tw/handle/4vpem2 |
work_keys_str_mv |
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