A Novel Low Cost Realization of Photonic Crystal Power/Ground Layer in PCB for Noise Suppression

• Main Authors: Guan-Zong Wu, 吳冠宗
• Other Authors: 吳宗霖
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/35822878465926394693

碩士 === 國立臺灣大學 === 電信工程學研究所 === 96 === This thesis focuses on the suppression of simultaneous switching noise (SSN) in high-speed circuits. A photonic crystal power/ground layer (PCPL) was proposed previously to eliminate the SSN in the PDN of the PCB or package. Since the PCPL structure is hard to be fabricated in PCB and package due to the property of presently developed High-DK material, two structures are proposed in this thesis to overcome the difficulty. The high-DK via bundle PCPL structure is proposed to provide several equivalent High-DK materials with different effective DK to design the bandgap more flexibly. The through hole PCPL (TH-PCPL) structure is proposed to be a low cost realization of the PCPL structure in four layer PCB. The first stopband of TH-PCPL is almost the same as the first stopband of previous PCPL. TH-PCPL is fabricated on four layer FR4 PCB and good agreement is shown between the measurement and simulation results. Demonstration of noise isolation on RF circuits is shown in the last section.