Dynamic Analysis for Heat Pipe Cooling Module

• Main Authors: Cheng-Yu Cheng, 鄭丞佑
• Other Authors: Sih-Li Chen
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/67602080107772691536

碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === The higher penetration rate and better performance efficiency of personal computer (PC) nowadays has led to the improvement of cooling technology, increasing demand, and higher quality requirement of heat pipe cooling module. Following this trend, the topic of Quality Management becomes more and more important. Therefore, the existing problem of long examination process, which causes worse manufacturing efficiency and higher cost, turns to be one issue to be further improved in cooling field. Our research focus on designing the experiment methodology and process for heat pipe cooling module, and try to analyze the temperature response change of each component in heat pipe cooling module under different situations. The main experimental parameters include the heating methods, heating temperature, and time to turn on the fan. In addition, based on Lumped System theory, we build up a simulation model to find out the dynamic temperature response of heat pipe cooling module, and then set up experimental parameters. Under this simulation, we could reduce the time and cost on testing parameters and analysis principles with try and error method. The study proves to be the successful simulation model to find out suitable parameters range and analysis principles under different heating methods. Finally, our research results successfully shorten the examination time to 30 seconds through transient examination method.