Optimization of Light Emitting Diode Processing Parameters Using Thermo-Ultrasonic Flip-Chip Bonding Technology
碩士 === 國立臺灣科技大學 === 高分子系 === 96 === The light emitting diode (LED), a new light source in the twenty-first century, contains many advantages, such as high efficiency, long lifespan, and bold structure. The technology for chip packing is the focal point to increase LED quality and performance. Flip-c...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12377697772608678989 |