Fabrication of MEMS probe card using standard CMOS technology with flip chip solder bumps
碩士 === 國立臺北科技大學 === 機電整合研究所 === 96 === This thesis aims to combine MEMS process with micro electroforming technology to fabricate vertical spring-probe, which can be applied to wafer level probe card .This probe card includes a CMOS chip and a print circuit board. The said CMOS chip based on the sta...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rmhj43 |