Summary: | 碩士 === 雲林科技大學 === 工業工程與管理研究所碩士班 === 96 === Burn-in has been widely used as an effective procedure for screening out failures in the early operating period of the electronic product, before it is shipped to the customers. Increasing the environmental stress such as temperature can effectively shorten the burn-in time, and this method is usually called accelerated burn-in.
When different stress levels are chosen in the burn-in operation, the burn-in times have to be redetermined.
Arrhenius model can describe the lifetime of electronic products under different temperature levels. In this paper, Arrhenius model and its mean residual life function are applied into the accelerated burn-in cost model, and the genetic algorithm is used to solve the optimal accelerated burn-in time and temperature level. We then choose a real case of TFT-LCD module as an example to illustrate the determination of its optimal accelerated burn-in time and temperature level. A sensitivity analysis of TFT-LCD module case shows the effect of model parameters on optimal burn-in time and temperature level.
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