RESEARCH OF TEXTURE FORMING FOR STAINLESS STEEL SUBSTRATE AND ITS SPECTRAL ANALYSIS

碩士 === 元智大學 === 機械工程學系 === 96 === Due to cost and efficient considerations, current research development of solar cell mainly concentrates on thin film solar cell. However, photoelectric layer of thin film solar cell is thinner than solar cell and beam route of reactive layer will be abbreviated and...

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Bibliographic Details
Main Authors: Cheng-Wei Peng, 彭成偉
Other Authors: Shuo-Jen Lee
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/09613632129242351756
Description
Summary:碩士 === 元智大學 === 機械工程學系 === 96 === Due to cost and efficient considerations, current research development of solar cell mainly concentrates on thin film solar cell. However, photoelectric layer of thin film solar cell is thinner than solar cell and beam route of reactive layer will be abbreviated and the reaction efficient will be decreased. As a result, most research organizations stress on improving beam route. The aim of the research focuses on the texture forming process of stainless steel substrate of solar cell. Via photolithography Process and etching techniques, irregular and special figures in different size, distance and texture forming conditions are formed on stainless steel substrate. Based on surface processing of electropolishing(EP) and silver-planted process, total reflection and diffuse reflection of spectrum can be advanced. Lastly, in order to understand the correlation among various texture structure, characteristic of spectrum and adhesion capability, spectrum examination on stainless steel surface and adhesion capability of sliver-plated process will be tested. Under spectrum research, various texture structures will result in different spectrum regulations. Nevertheless, due to controlling difficulties in etching process, the regulations of some texture structures can not be clarified. In adhesion experiment, because of the choice of evaporation method in silver-plated process, adhesion capability is too poor to assess. Hence, other plated process and tape test of ASTM are recommended to use in adhesion test.